Smart Electronics 8 Layer Immersion Gold Impedance HDI Board

8 layer immersion gold impedance HDI board

Product Overview

Our 8-Layer ENIG Impedance Control HDI board is the cornerstone for core modules in modern, high-end electronic devices. Engineered to tackle design challenges of compact space, high signal speeds, and stringent reliability requirements, this product combines an 8-layer multilayer design, High-Density Interconnect (HDI) technology, precision impedance control, and Electroless Nickel Immersion Gold (ENIG) surface finish. It provides a stable and reliable platform for your communications equipment, industrial control systems, advanced computing, medical instruments, and aerospace applications.

Core Technologies & Advantages

1. 8-Layer Precision Stack-up

• Superior Electrical Performance: The 8-layer structure provides ample ground and power planes, creating clear signal return paths. This effectively reduces electromagnetic interference (EMI) and power noise, ensuring stable circuit operation in complex environments.

• Enhanced Routing Capability: Sufficient routing layers solve the interconnection challenges of high-density, multi-pin components (e.g., BGA, FPGA, high-speed processors), improving design success rates and flexibility.

2. HDI (High-Density Interconnect) Technology

• Microvia (Blind/Buried) Design: Utilizes laser drilling to achieve direct and precise interconnections between layers, avoiding the space consumption of through-holes.

• Optimal Space Utilization: Enables integration of more functionality into a smaller board area, a key technology for product miniaturization and thinning.

• Improved Signal Quality: Shorter interconnect paths reduce signal delay and parasitic effects, particularly beneficial for RF and high-speed digital signals.

3. Precision Impedance Control (±10%)

• What is Impedance Control? By precisely calculating and controlling trace width, thickness, dielectric thickness, and constant, the line impedance is matched to the driver's output and receiver's input impedance.

• Core Value: Minimizes signal reflection and distortion during high-speed transmission, ensuring signal integrity and timing accuracy. This is critical for data rate and stability. We deliver high-precision impedance control within ±10% to meet stringent requirements for interfaces like PCIe, DDR4, and USB 3.0/3.1.

4. ENIG (Electroless Nickel Immersion Gold) Surface Finish

• High Surface Flatness: The gold layer is extremely flat, ideal for soldering fine-pitch components (e.g., µBGA), preventing bridging or poor solder joints due to surface unevenness.

• Excellent Solderability & Shelf Life: The gold layer prevents copper oxidation during storage, maintaining long-term solderability. The nickel layer acts as a barrier, preventing copper-gold diffusion and creating robust solder joints.

• Reliable Contact Performance: Gold offers good conductivity and corrosion resistance, making it perfect for contact surfaces like gold fingers, test points, or switch contacts.

Typical Applications

• Communications: 5G Base Stations/Terminals, High-End Routers, Network Switches, Optical Modules

• Computing & Storage: Server Motherboards, AI Accelerator Cards, High-End GPUs, SSDs

• Industrial & Medical: Industrial Control Boards, Advanced Test Equipment, Medical Imaging Devices

• Automotive Electronics: ADAS/AD Control Units, Advanced Driver-Assistance Systems

• Consumer Electronics: Flagship Smartphones, Drone Core Boards, Premium Wearables

Technical Specifications Table

Why Choose Us?

• Expert Support: Full-cycle technical support from stack-up design and impedance calculation to DFM analysis.

• Stringent Quality Control: Adherence to IPC Class 2/3 standards, with Flying Probe Test, AOI Inspection, and impedance sampling to ensure specification compliance.

• Rapid Response & Delivery: Advanced HDI production lines enable flexible and fast turnaround for prototypes and low-to-mid volume batches.

• One-Stop Service: Complete electronic manufacturing services from PCB fabrication to component sourcing and PCBA assembly.